A flash curing system for solid freeform fabrication which generates a plurality of radiation emitting pulses that forms a planar flash. The planar flash initiates curing of a curable material dispensed by a solid freeform fabrication apparatus. The radiation emitting pulses have a high peak power value that releases a sufficient quantity of free radicals from the photoinitiator to initiate curing and overcome the problem of oxygen inhibition. Substantially less power is consumed and less heat generated by the flash curing system compared to conventional continuous emission curing systems.

 
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