A speaker housing for mounting at least one speaker therein is disclosed. The speaker housing includes a speaker enclosure sealed to a speaker cover. The speaker enclosure includes an opening for sealing a connector attached to a crossover printed circuit board assembly thereto. The connector protrudes through the opening in the speaker enclosure while the printed circuit board to which it is attached compresses a compressible gasket against a wall surrounding the opening in the speaker enclosure, sealing the connector thereto. The chassis wiring is coupled to the connector providing an inexpensive sealed interface between the electronics chassis and the crossover board assembly.