An imaging device chip set includes an imaging chip provided for obtaining an electric signal by photoelectric conversion of incident light, and a DSP chip provided for carrying out digital signal processing with respect to the electric signal obtained by the imaging chip. The imaging chip includes a plurality of unit pixels for generating the electric signal by the photoelectric conversion of incident light, a horizontal scanning circuit for selecting the unit pixels in a horizontal direction, and a vertical scanning circuit for selecting the unit pixels in a vertical direction. The DSP chip includes a timing generating circuit for generating timing pulses necessary for operations of the horizontal scanning circuit and the vertical scanning circuit, and a digital signal processing circuit for carrying out digital signal processing with respect to the electric signal generated by the plurality of unit pixels. The timing generating circuit and the digital signal processing circuit, which are included in the DSP chip, are formed with CMOS transistors. The plurality of unit pixels, the horizontal scanning circuit, and the vertical scanning circuit, which are included in the imaging chip, are formed with transistors of the same conductivity type.

 
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> Optical monitoring apparatus with image-based distance accommodation

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