There are provided a polypropylene resin composition comprising: (i) 10 to 99% by weight of a specific propylene copolymer (X), (ii) 0 to 60% by weight of a specific copolymer (Y), and (iii) at least one member selected from the group consisting of 1 to 30% by weight of a specific propylene polymer (W) and 0.1 to 3 parts by weight of a nucleating agent (N); and a film comprising said polypropylene resin composition, or a laminated film having a layer comprising said polypropylene resin composition.

 
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> Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame

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