Semiconductor components having a semiconductor body which includes a semiconductor base surface have to be sealed with a molding compound in order to protect against moisture or heat. Mechanical interlocking of the molding compound to the semiconductor base surface is achieved by means of at least one interlocking structure. This may be either a horizontal interlocking structure for mechanically interlocking the molding compound to the semiconductor base surface in the direction which is horizontal with respect to the semiconductor base surface and/or a vertical interlocking structure for mechanically interlocking the molding compound to the semiconductor base surface in the direction which is vertical with respect to the semiconductor base surface.