An optical package includes one or more MEMS mirrors to provide alignment between internal optical components and the signal port(s) on the package (where one or more ports may include optical fiber attachments). Once the components are placed in the package, an electrical signal is used to adjust the deflection profile of the appropriately positioned MEMS mirror(s) until maximum coupling between the internal components and the fibers/ports is obtained. Advantageously, if later signal degradation occurs due to, for example, subsequent physical misalignment of the internal components, corrective electrical signal can be sent to the MEMS mirror(s) to provide correction and re-alignment without having to open the package and physically move the components.