Nonvolatile memory devices and methods of fabricating and driving the same are disclosed. Disclosed devices and method comprises: growing an oxide layer on a substrate and depositing a nitride layer on the oxide layer; patterning the nitride layer; forming injection gates on the lateral faces of the nitride layer; depositing a first polysilicon, a dielectric layer and a second polysilicon on the surface of the resulting structure, sequentially; patterning the second polysilicon, the dielectric layer and the second polysilicon to form gate electrodes; removing the nitride layer between the injection gates; forming source and drain extension regions around each of the gate electrodes by performing an ion implantation process; forming sidewall spacers on the lateral faces of the gate electrodes; and forming source and drain regions in the substrate by performing an ion implantation process with the sidewall spacers as an ion implantation mask.

 
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> Semiconductor device with an analog capacitor

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