A semiconductor device is provided including a substrate containing a wire pattern having a plurality of leads and a semiconductor chip mounted on the substrate in a manner that an electrode faces the wire pattern. The electrodes are arranged to be classified into a plurality of first groups respectively lined along a plurality of paralleling first straight lines and into a plurality of second groups respectively lined along a plurality of second straight lines extending in a direction so as to intersect with the first straight lines. Each lead includes a connecting part facing one electrode, an extension part extending along the first straight line from the connecting part, and a draw-out part that is drawn from the extension part so as to intersect with the first straight line.