A modeling module is disclosed that couples to a modular platform chassis. The modeling module includes a resident management controller to implement a test to model a component layout for a module to be received and coupled to the modular platform chassis. The test includes an operating thermal load for a component resident on the module at a given location. The module has a dimensional length and width that is similar to that of the modeling module. The modeling module also includes a thermal load device that is responsive to the management controller. The thermal load device is to implement at least a portion of the test by simulating the operating thermal load for the component resident on the module at the given location.