According to an embodiment of the present invention, an improved method and system are provided. In one embodiment, a conductive connection is made between two metal layers separated by an intermediate insulating layer by providing vias between one of the metal layers and the insulating layer. A conductor, such as a conductive sphere made of gold is disposed into the vias and pressed so as to create a conductive connection between the metal layers. In a further embodiment, vias are created in both metal layers. In such a case, a fixture support may be provided so that when the conductive sphere is pressed into the vias, it is also pressed into the support to improve the conductive connection.