A ceramic structure having a scaffold with at least one opening and at least one porous filler material at least partially filling the at least one opening is described. The porous ceramic filler includes a plurality of pores. The pores have an average size in a range from about 2 nm to about 100 nm. The plurality of pores includes at least one pore architecture. For each pore architecture, the average pore size does not vary by more than about 100% when the average pore size is in a range from about 2 nm to about 50 nm, and the average pore size does not vary by more than about 50% when the average pore size is greater than about 50 nm. The plurality of pores includes at least two pore architectures when the porous filler material is silica. Also described is a method of making the ceramic structure.

 
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> Electro chemical mechanical polishing method and device for planarizing semiconductor surfaces

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