A heat dissipating structure for a computer host is disclosed. The heat dissipating structure is fixable to a housing of the computer host and is provided for a heat dissipating fan for dissipating heat. The heat dissipating structure includes a fan fixing housing including a front opening and a hollow network, the fan fixing housing being a hollow frame; a plurality of first fixing portions formed in a peripheral region around the front opening of the fan fixing housing; and a plurality of second fixing portions corresponding to the first fixing portions and formed on a peripheral region of the hollow network of the fan fixing housing.