An electronic module that operates at various radio frequency standards is provided. The module includes a first integrated circuit die formed in a first semiconductor substrate and manufactured using a first semiconductor process. Disposed within the first integrated circuit is the first signal conditioning circuit for performing a function and a first ancillary circuit. The first ancillary circuit electrically coupled to the first signal conditioning circuit for use by the first signal conditioning circuit during operation thereof. Also within the module is a second integrated circuit formed in a semiconductor substrate, disposed within the second integrated circuit is a second signal conditioning circuit. The second signal conditioning circuit being electrically coupled to the first ancillary circuit such that during operation the first ancillary circuit is connected to either one of the first signal conditioning circuits or one of the second signal conditioning circuits. The other than selected conditioning circuit being other than electrically controlled by the first ancillary circuit. The second integrated circuit die benefits from the operation of the first ancillary circuit for performing control, power management and feedback.