A conductor assembly and methods for mechanically and electrically coupling a small diameter conductor to a lead component having a relatively larger sized conductor bore is provided. The assembly includes a sizing member sized to fit securely around a relatively small diameter conductor and to further fit within a conductor bore so that temporary compression (e.g., crimping, crushing, or staking) of a discrete portion of the conductor bore mechanically couples, and establishes electrical communication between, the conductor and the lead component. Alternately, a conductive sleeve member having a relatively large diameter conductor bore is adapted to receive a sizing unit to downsize one side of the sleeve member in a manner similar to the foregoing. In this case, a relatively smaller diameter one of a pair of different diameter elongated conductors is firmly mechanically coupled and in electrical communication with a relatively larger diameter conductor.