A wired circuit board prevents a sealing resin filled in an electronic component mounting portion from overflowing and spreading to a different area other than the electronic component mounting portion. An electronic component placing area is provided in the electronic component mounting portion for the electronic component to be placed and terminals are located within the electronic component placing area and formed to extend continuously with the conductive wires. Also, a groove extending around the electronic component mounting portion to intersect with the conductive wires is formed in the insulating cover layer. Further, protrusions protruding in a direction of the conductive wires being extended in the groove are formed at an intersecting portion thereof with the conductive wires. This can reduce a tendency of the overly filled sealing resin to flow over the groove, thus preventing the spread of the sealing resin from the groove to the outside thereof.