A circuit board includes an insulating substrate, a first conductive layer
on the insulating substrate, a second conductive layer on the first
conductive layer, and a third conductive layer covering the first
conductive layer and the second conductive layer. The first conductive
layer has a surface provided on the surface of the insulating substrate,
and a surface having a width smaller than a width of the above surface.
In this circuit board, the conductive layers have small impedances even
if a high-frequency signal flows in the conductive layers.