The present invention provides an electroconductive adhesive having a heme protein mixed in a very small amount thereby exhibiting electrical conductivity without deteriorating adhesion, which is used on the surface of electronic parts or a label thereby preventing and eliminating static electricity and improving the efficiency of heat dissipation, as well as an adhesive article using the same. A heme protein having a porphyrin complex whose iron ion is divalent is added to an adhesive to confer electrical conductivity. At least one member selected from an electroconductive polymer, an electrolytic metal, and a pigment molecule is mixed with the resultant electroconductive adhesive.