Disclosed is a method and apparatus for reducing vibrations in an electrical device, wherein the apparatus comprises a plurality of stacked metal plates, wherein the stacked metal plates move frictionally opposed to one another upon excitation of the device, and wherein movement of the stacked metal plates produces damping of the vibrations. The apparatus further comprises a clamp retaining the stacked metal plates, and a plurality of retaining mechanisms, wherein the clamp adjusts a force holding the stacked metal plates together, and wherein the clamp controls an amount of friction produced by the movement of the stacked metal plates. Also, the surfaces of the stacked metal plates comprise a machined surface finish, wherein the machined surface finish controls an amount of friction produced by the movement of the stacked metal plates. Moreover, the stacked metal plates are dimensioned and configured to control a frequency response of the vibrations.