An electronic circuit device includes at least a first substrate and a second substrate, a spacer substrate interposed between the first substrate and the second substrate, an electronic component interposed between the first substrate and the second substrate, and at least one through-hole formed on the second circuit substrate opposing the first circuit substrate. The spacer substrate mutually connects the first substrate and the second substrate. The electronic component is connected to the first circuit substrate with the active surface of the electronic component. The through-hole penetrates from a first surface of the second circuit substrate opposing the first substrate to a second surface of the second circuit substrate. The first circuit substrate is connected to the electronic component.