Methods of forming an electronic structure may include forming a seed
layer on an electronic substrate, and forming a conductive shunt layer on
portions of the seed layer wherein portions of the seed layer are free of
the conductive shunt layer. A conductive barrier layer may be formed on
the conductive shunt layer opposite the seed layer wherein the conductive
shunt layer comprises a first material and wherein the barrier layer
comprises a second material different than the first material. Moreover,
a solder layer may be formed on the barrier layer opposite the conductive
shunt layer wherein the solder layer comprises a third material different
than the first and second materials. Related structures are also
discussed.