A method of changing the temperature of a substrate during processing of
the substrate includes providing the substrate on a substrate holder, the
substrate holder including a temperature controlled substrate support for
supporting the substrate, a temperature controlled base support for
supporting the substrate support and a thermal insulator interposed
between the temperature controlled substrate support and the temperature
controlled base support. The method further includes setting the
temperature of the base support to a first base temperature corresponding
to a first processing temperature of the substrate, setting the substrate
support to a first support temperature corresponding to the first
processing temperature of the substrate, setting the temperature of the
base support to a second base temperature corresponding to a second
processing temperature of the substrate, and setting the substrate
support to a second support temperature corresponding to the second
processing temperature of the substrate.