Generally, methods and apparatus are disclosed for fabrication of angle-of-incidence layers on a substrate. In one embodiment, the angle-of-incidence layers may have either radial or circumferential tilt symmetry, using, for example, sputtering or evaporation techniques. In one example, an apparatus for sputtering material comprises a substrate support member, a cathode positioned in substantially facing relationship with respect to the substrate support member and a shutter plate. The shutter plate is disposed between the substrate support member and the cathode and defining an aperture for selective transmission of sputtered articles from the cathode on the basis of a non-perpendicular trajectory angle relative to a plane of the substrate support member.