Disclosed is a gas barrier film alternately comprising at least one inorganic layer and at least one organic layer on a resin base material having a glass transition temperature of 250.degree. C. or higher. The gas barrier film can exhibit superior gas barrier property when it is used in image display devices such as liquid crystal display devices and organic EL devices.

 
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> Methods for forming strained-semiconductor-on-insulator device structures by use of cleave planes

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