A method, apparatus and machine-readable medium for improving communication between logic elements in an integrated circuit (IC) is provided. This is achieved by using a point-to-point approach for IC placement and routing, to address the increase in complexity in terms of design size and/or Deep Sub-Micron physical effects. The method involves providing a separate conductor member between an output of a logic element and each of one or more logic elements for interconnecting the one or more logic elements with the logic element. The method further involves providing a separate buffer between the output of the logic element and each of the one or more logic elements for interconnecting the one or more logic elements with the logic element. Furthermore, the method involves interconnecting the output of the logic element and the one or more logic elements, using the provided separate conductor member, and the provided separate buffer.