Apparatuses and methods for cooling processors and other electronic components in computers and other systems are disclosed herein. A heat sink configured in accordance with one embodiment of the invention includes a heat pipe structure. The heat pipe structure includes an interface portion offset from a body portion by a leg portion. The interface portion is configured to be positioned proximate to a processor or other electronic device, and the body portion is configured to be spaced apart from the electronic device. The heat pipe structure further includes a working fluid. The working fluid is positioned to absorb heat from the electronic device at the interface portion of the heat pipe structure and transfer the heat to the body portion of the heat pipe structure. In one embodiment, the heat sink can further include a plurality of cooling fins attached to the body portion of the heat pipe structure.