A Damascene process is provided for manufacturing a coil structure for a
magnetic head. During the manufacturing process, an insulating layer is
initially deposited after which a photoresist layer is deposited. A
silicon dielectric layer is then deposited on the photoresist layer.
After masking the silicon dielectric layer, at least one channel is
etched in the photoresist layer and the silicon dielectric layer. Then, a
conductive seed layer is deposited in the at least one channel. The at
least one channel is then ready to be filled with a conductive material
and chemically/mechanically polished to define a coil structure.