Embodiments of the invention are directed to electronic device housings and may be particularly applicable to portable electronic devices. In an embodiment, an assembly comprises a first housing element that forms a first recess, a second housing element that contacts the first housing element, wherein the first recess faces away from the second housing element and the second recess faces towards the first housing element, wherein the first housing element and the second housing element combine to form an enclosure, and an electronic component within the enclosure. Embodiments of the invention increase shielding of electronic components within the housing and also reduce leakage paths through an interface between elements of the housing.