A flexible wired circuit board having a fine pitch conductor wiring pattern that can be produced with a high yield rate and improved productivity, includes a first and a second flexible wired circuit board which are disposed to be adjacent to each other on a supporting board so that a first and a second connection terminal are connected to a same electronic component. When a defect occurs in the first flexible wired circuit board in the production process in which the first conductor wiring pattern of the first flexible wired circuit board is formed into the fine pitch, only the defective first flexible wired circuit board can be screened out as a defective product. Thus, the first flexible wired circuit board having no defects can be selected for combination with the second flexible wired circuit board. Thus, the flexible wired circuit board can be produced in a high yield rate.