A device includes a plurality of organic electronic devices disposed on a substrate, wherein each of the plurality of organic electronic devices comprises a first electrode and a second electrode, and wherein each of the plurality of organic electronic devices is electrically coupled in series. Further, the device includes an electro-active material disposed between the first and second electrodes of each of the plurality of organic electronic devices. In addition, the device includes an interconnect layer disposed on the substrate, wherein the interconnect layer is configured to electrically couple each of the plurality of organic electronic devices in series via coupling the respective first and second electrodes of each of the plurality of organic electronic devices.