An integrated modular avionics (IMA) cabinet for housing printed circuit board (PCB) modules includes a chassis configured with slots for receiving the PCB modules. The chassis of the IMA cabinet also includes a rear panel configured for connecting to connectors, wire harnesses, and the like. Additionally, the PCB modules include a front panel configured with screws for securing the PCB modules to the chassis of the IMA cabinet. The PCB modules also include retractable handles for transporting the PCB modules. The chassis of the IMA cabinet is also configured with ventilation holes for cooling the PCB modules. The IMA cabinet is further configured to be EMI/RFI resistant. In an exemplary embodiment, the IMA cabinet is configure such that substantially all of the electronic and/or computer components are disposed on the PCB modules and not in the IMA cabinet, thus reducing the overall cost of the IMA cabinet and facilitating easier and quicker reconfiguration, repair, and replacement of the PCB modules.