An integrated circuit package comprises an integrated circuit that
comprises a temperature sensor that senses a temperature of the
integrated circuit. A memory module stores data relating to oscillator
calibrations and selects one of the oscillator calibrations as a function
of the sensed temperature. An oscillator module generates a reference
signal having a frequency that is based on the selected one of the
oscillator calibrations. A packaging material encases at least part of
the integrated circuit and has a low dielectric loss.