According to one embodiment of the invention a method for determining the location of a potential defect in a device includes scanning a surface of the device with a temperature sensor while operating the device. The method also includes measuring a temperature of the device by a temperature sensor at a plurality of locations while scanning. Based upon the measured temperatures, a temperature profile is constructed for the device. The method also includes comparing the constructed temperature profile to a reference profile to determine a location of the potential defect in the device.