A miniaturized multi-chip module suitable for application to wireless
transmission devices includes a substrate, integrated circuit chips
mounted on and connected electrically to the substrate, and an interposer
mounted on one surface of the substrate. The interposer cooperates with
the substrate to confine a receiving space for receiving the integrated
circuit chips on the surface of the substrate to which the interposer is
attached, and is provided with conductors that are connected electrically
to the substrate. Therefore, when the interposer is mounted on a circuit
board, the conductors serve as external electrical connections for the
integrated circuit chips. A method for manufacturing the miniaturized
multi-chip module is also disclosed.