The invention relates to an electrical circuit arrangement (3) having electrical and/or electronic components (4). The components (4) are arranged on a mount substrate (5). The conductor tracks (6) for electrical connection of the components (4) are also located on the mount substrate (5). The mount substrate (5) comprises a metal part (7). An electrically insulating coating (9) is applied to one surface (8) of the metal part (7), to be precise in particular to that surface (8) which faces the components (4) and the conductor tracks (6). At least one component (4) and/or at least one conductor track (6) are/is located on the coating (9).