A method of fabricating a circuit lead, the method comprising: (a) depositing a slurry upon a substrate in a predetermined pattern, the substrate including a plurality of substantially uniformly patterned micropores operative to drain a fluid component of the slurry from the surface of the substrate, while maintaining conductive particles of the slurry on a surface of the substrate; and (b) drying the conductive particles to secure the conductive particles upon a surface of the substrate and provide a circuit lead. The invention also includes an electronic circuit comprising: (a) a substrate including a plurality of micropores that are substantially uniformly patterned; (b) a microchip; and (c) a circuit lead in electrical communication with the microchip and contacting the substrate, the circuit lead comprising conductive particles deposited upon the substrate by ejecting a slurry from an inkjet printer.