A method of making a light emitting device is disclosed. The method
includes the steps of providing a light emitting diode and forming an
encapsulant in contact with the light emitting diode; wherein forming the
encapsulant includes contacting the light emitting diode with a
photopolymerizable composition consisting of a silicon-containing resin
and a metal-containing catalyst, wherein the silicon-containing resin
consists of silicon-bonded hydrogen and aliphatic unsaturation, and
applying actinic radiation having a wavelength of 700 nm or less to
initiate hydrosilylation within the silicon-containing resin.