A semiconductor device according to an embodiment of the present invention
comprises a packaging substrate mounted with semiconductor chips; a heat
dissipation metal plate having three or more sides and mounted with the
packaging substrates; a frame provided along an external periphery of the
heat dissipation metal plate and encircling the packaging substrates; an
adhesive provided to between the heat dissipation metal plate and the
frame to bond the heat dissipation metal plate and the frame together;
and a sealing resin sealing the semiconductor chips and the packaging
substrates within a box formed by the heat dissipation metal plate and
the frame, wherein the volume of the adhesive at corners of the heat
dissipation metal plate is smaller than that on the sides thereof.