The present invention relates to a process for preparing an adhesive bond by i) applying an aqueous dispersion or solution containing a) at least one isocyanate-reactive polymer and b) at least one solid surface-deactivated polyisocyanate to a ii) substrate, iii) drying the aqueous dispersion or solution at a temperature from 20 to 95.degree. C. to form an adhesive layer and iv) treating the adhesive layer with heat at a temperature greater than the temperature used to dry the aqueous dispersion or solution. The present invention also relates to a process for preparing a bond by combining at least one substrate with the adhesive bond of the present invention.Adhesive bonds of the present invention have a shear strength at least 10% greater than the shear strength of adhesive bonds containing a substrate having at least one adhesive layer based on an aqueous dispersion or solution composed of a) and b) dried at a temperature from 20 to 95.degree. C.