A polyethylene-based resin molding material having an ethylene-based
polymer in an amount from .gtoreq.20% to <30% by weight that has a
high load melt flow rate (HLMFR) at a temperature of 190.degree. C. under
a load of 21.6 kg of 0.1 to 1.0 g/l0 min and a density of 0.910 to 0.930
g/cm3; and an ethylene-based polymer in an amount from >70% to
.ltoreq.80% by weight that has a melt flow rate (MFR) at a temperature of
190.degree. C. under a load of 2.16 kg of .gtoreq.150 g/10 min to <400
g/10 min and a density of .gtoreq.0.960 g/cm3; and wherein the
polyethylene-based resin molding material has an MFR from .gtoreq.0.4
g/10 min to <2.0 g/10 min, an HLMFR from .gtoreq.70 g/10 min to
<180 g/10 min, an HLMFR/MFR of 100 to 200, and a density from
.gtoreq.0.953 g/cm3 to <0.965 g/cm3.