A bonding wire (1) includes a matrix material (2) and a filler (3) embedded in this matrix material (2), the coefficient of thermal expansion of the filler (3) being lower than the coefficient of thermal expansion of the matrix material (2), and the filler (3) content by weight amounting to at least 25% of the weight of the bonding wire (1). Also, a bonded connection between a bonding wire and a substrate may use such a bonding wire.