Method for conditioning of an electronic microcircuit designed for the production of an electronic module which can be glued by means of a simple glue or by soldering. For this purpose the microchip has a geometric shape compatible with a recess in a card provided to accommodate it and has a means serving as a mask compatible with the card. Ultimately this mask also serves to prevent an outflow of a resin coating used to protect a chip included in this type of module. The mask is glued to a support having, on a first face, the contact area, and on a second face the mask and the chip. The mask includes a window determining the placement of the chip.