An anisotropic conductive film (10) is used for bonding a semiconductor component to a circuit board. The anisotropic conductive film includes an insulative adhesive film (12) and a plurality of nano-scaled conductive particles (14). The nano-scaled conductive particles are dispersed in the insulative adhesive film. The nano-scaled conductive particles are a nanotubes each containing metal particles and polyaniline therein. Because the sizes of the nano-scaled conductive particle are very small, more of the nano-scaled conductive particles can be compressed between two corresponding contacts of the semiconductor component and the circuit board. The interface area between the two corresponding contacts is correspondingly enlarged. In addition, the polyaniline both in the opening and inside of the nanotubes also has a more favorable viscosity. The bonding effect between a semiconductor component and a circuit board is improved.