A leadframe for a semiconductor device of the present invention is a leadframe for a semiconductor device having a stage section where a semiconductor chip is to be mounted, an inner lead section connected to the stage section, and an outer lead section connected to the inner lead section. The leadframe has (1) a nickel (Ni) layer 1, (2) a palladium (Pd) or palladium alloy layer 2, (3) a tin (Sn) or tin alloy layer or a zinc (Zn) or zinc alloy layer 3, 3a, or 3b, and (4) a gold (Au) layer 4, 4a, or 4b, all of which are formed on a base material B forming the leadframe in sequence from the surface of the leadframe.