An implantable microstimulator includes a plastic housing having a first end; an electronic subassembly; and a conductive plastic electrode disposed at the first end of the plastic housing and in electrical communication with the electronic subassembly. The microstimulator forms a hermetically sealed structure. Optionally, the microstimulator also includes a second electrode disposed at a second end of the plastic housing and in electrical communication with the electronic subassembly. The second electrode may also be a conductive plastic electrode.