A drywall sealing tape which includes a substrate layer and a mesh layer made of mesh filament. The mesh layer is an array of filaments formed together which, when adjacent the substrate, create an inter-filament cavity for receiving and retaining joint compound between the substrate and the drywall panel. In use, the drywall sealing tape of the present invention may be coated with joint compound and applied to a drywall panel. The inter-filament cavities retain a volume of joint compound corresponding to the approximate thickness of the mesh filament. The joint compound retained within the cavities serves to bond the drywall sealing tape of the present invention to the drywall panels, and provides a seamless, crack-resistant surface.