The invention integrally arranges a lens, an optical filter, a
semiconductor imaging device, on-chip components, and a printed circuit
board on a three-dimensional circuit board and contrives the lens
attachment structure, bonding method, color of an adhesive, masking of
the lens, etc. in order to implement a structure that allows high
performance, compact, lightweight and rigid design, and mass production,
as well as a high-quality picture.