A diamond foam spray cooling system for improving the thermal management of a heat producing device. The diamond foam spray cooling system includes a thermal management unit including a spray assembly, a chamber, a heat spreader and at least one diamond foam section thermally attached to a cooling surface of the heat spreader. The spray assembly sprays liquid coolant directly upon the engaging surface of the diamond foam section. A portion of the liquid coolant is evaporated from contacting the engaging surface and a portion of the liquid coolant passes into an immersion zone within the diamond foam section. Alternatively, the diamond foam section is thermally attached directly to the heat producing device. The diamond foam section may have varying thicknesses, cavities, raised portions and other configurations.