A method for contacting patterned electrode devices includes the steps of providing a porous substrate, depositing electrically conductive material to form at least one electrode on a front-side of the porous substrate and depositing at least one electrically conductive back-side contact trace on the back-side of the substrate. A portion of the electrically conductive material penetrates into the substrate. A device is formed including the electrode on the front side of the substrate, wherein the electrode is electrically coupled by a conducting channel including the electrically conductive material through the substrate to the back-side contact trace.