A package for semiconductor light emitting element is described. The package includes a first metal substrate having a cup shaped recess portion, an insulating member having a first cup shaped opening, provided on the first metal substrate, and a second metal substrate having a second cup shaped opening, provided on the insulating member with being electrically insulated from the first metal substrate, having a cavity in the inner surface.

 
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> Thin, thermally enhanced molded package with leadframe having protruding region

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