A high-density orthogonal connector is disclosed and may include electrical contacts that are configured to receive contacts from an orthogonal header connector while minimizing signal skew and signal reflection. The electrical contacts in the connector may define contact pairs (e.g., differential signal pairs). Each contact pair may include a lead portion and a mating interface that extends from the lead portion. The lead portions of the contact pair may define a first plane. One contact of the contact pair defines a first mating interface defining a second plane and the other contact in the contact pair defines a second mating interface defining a third plane. The second plane and the third plane may be both substantially parallel to and offset from the first plane in opposite directions. The contact pair may be configured such that the overall length of each contact within the pair may be substantially the same.